Thermocompression Bonding and Adhesive Processing
There are two types of adhesive processing: hot-melt (processing) and hot-melt resin processing (dry method and semi-dry method).
Thermocompression bonding processing
This technology enables thermal processing utilizing the melting point of various kinds of synthetic fibers. Non-woven fabrics can be heat-set or laminated at a temperature range of 130°C to 300°C, which is equivalent to the melting point of polyethylene, polypropylene, polyester, and aramid.
In this method, pellet-type hot-melt resin is melted in a melting apparatus and then transcribed to a base material. The resin is transcribed in either film form or fibrous form. The transcription of resin in the film form is suitable for the compounding of various functional materials and that in the fibrous form is suitable for the bonding of filter materials that require air permeability.
Hot-melt resin processing (dry method)
With this method, a hot-melt adhesive dissolved in a solvent is applied over the metal roll to vaporize the solvent for removal and then transcribed to a base material. The adhesive resin works and functions as an adhesive when reheated before use.
Hot-melt resin processing (semi-dry method)
In this method, emulsion-type adhesive resin is applied to a base material by a knife coater or roll coater to dehydrate the moisture for removal. The adhesive resin fulfills its function as an adhesive when reheated before use.